Product Category
| Picha | Nambari ya Sehemu | Maelezo / PDF | Bei | Rfq |
|---|---|---|---|---|
 |
t-Global Technology |
THERMAL POTTING EPOXY 0.75KG PAC |
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|
 |
MG Chemicals |
MEDIUM CURE THERM COND ADH FLOW |
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|
 |
Wakefield-Vette |
SILICONE GREASE 4 GRAM |
|
|
 |
Wakefield-Vette |
TOUGHENED, FLEXIBLE ADHESIVE SYS |
|
|
 |
Henkel / Bergquist |
GF1500 50CC DUAL CARTRIDGE |
|
|
 |
MG Chemicals |
FAST CURE THERM COND ADH FLOW |
|
|
 |
MG Chemicals |
EPOXY |
|
|
 |
Laird - Performance Materials |
TPUTTY 508 360CC EFD CARTRIDGE |
|
|
 |
LOCTITE / Henkel |
LOCTITE NSWC 100 THERMAL GREASE |
Nipigie |
|
 |
t-Global Technology |
NON-SILICONE THERMAL PUTTY 4OZ L |
|
|
 |
Henkel / Bergquist |
GAP FILLER 4000 50CC CARTRIDGE |
|
|
 |
LOCTITE / Henkel |
STYCAST 2850FT BLU 3# INDIVIDUAL |
|
|
 |
Parker Chomerics |
THERM-A-GAP TC50 5.2W/M-K 180CC |
|
|
 |
ITW Chemtronics (Chemtronics) |
SILICONE GREASE 5 0Z TUBE |
|
|
 |
Laird - Performance Materials |
TPUTTY 508 CARTRIDGE |
|
|
 |
LOCTITE / Henkel |
3873 SELF SHIM HI COND THERM ADH |
|
|
 |
Ellsworth Adhesives |
EPOXY ENCAPSULANT 18 LB GALLON |
|
|
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MG Chemicals |
EPOXY MOLD RELEASE (NON SILICONE |
|
|
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Chip Quik, Inc. |
HEAT SINK COMPOUND - HIGH DENSIT |
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|
 |
t-Global Technology |
SILICONE THERMAL GREASE 50G JAR |
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